Flip Chip Tech
DBR Base Reflector & Insulation
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High Reliability
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High Reflectivity
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Area-wide Reflector
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Silver materials free

Eutectic & Wire bonding free
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Customized Flip Chip
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Reflow bonding process by Flux
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Reflow bonding process by Solder
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Customized low temperature solder pad (@150℃ ~ 260℃)
