Flip Chip Tech

DBR Base Reflector & Insulation
  • High Reliability
  • High Reflectivity
  • Area-wide Reflector
  • Silver materials free
Eutectic & Wire bonding free
  • Customized Flip Chip
  • Reflow bonding process by Flux 
  • Reflow bonding process by Solder
  • Customized low temperature solder pad (@150℃ ~ 260℃)

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