GPI Events
GPI takes booth in 2016 Taipei AMPA
Welcome to find the most advanced flip chip LED light source at GPI booth( I0604 in NanGang exhibition center) during 2016 Taipei AMPA! For more information, please visit:
GPI/ GeneLite successfully demonstrate CSP in 2016 LIGHTING JAPAN.
GPI releases thinner and higher efficiency CSP LED components to the niche lighting, backlighting, and automotive lighting markets.
2015 AMPA Innovation Awars
GPI LED flip chip inside. In house manufacture process and patent on the solution.
The major features including:
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Great Product Reliability
Eutectic bonding the LED chip on ceramic subtract. No wire required.
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Simple Heat Sink Design
Easy heat dissipation through big contact area. Low thermal resistance 1.5℃ / W.
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Excellent Optical Efficiency
High luminous output (220 lm/mm2). Easy optical design to meet auto lighting cortication.
